Thermally conductive de-bonding aid
US10369774B2 · kind B2 · utility
0Cited by
15References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Jun 30, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Touchscreen computing devices are often assembled by applying an adhesive to an interface perimeter between a cover glass and a chassis. Occasionally, a device is de-bonded to troubleshoot errors in the functionality of the device. The adhesive often is resistant to releasing the bond between the cover glass and a chassis by mechanical force and the cover glass may be damaged during disassembly. Passive and/or active de-bonding aids facilitate transfer of thermal energy to the adhesive in a manner that avoids or minimizes the transfer of thermal energy to heat-sensitive components of the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.