Electronic component and corresponding mounting method
US10371357B2 · kind B2 · utility
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8Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 11, 2015 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Jul 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component may include e.g. a solid-state light radiation source, preferably a LED light radiation source, is provided with electrical contact pads for soldering onto a mounting board. The electrical contact pads are arranged over a soldering area having a central portion and a peripheral portion surrounding said central portion.The electrical contact pads include at least one first electrical contact pad arranged at central portion of the soldering area, and at least one second electrical contact pad arranged at peripheral portion of the soldering area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.