Heat dissipation device
US10371457B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Dec 19, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F1/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device includes a first fin group, a second fin group, a heat pipe and a base. The base is in thermal contact with a heat source. The heat pipe includes a first pipe part and a second pipe part. The second pipe part is connected with the first pipe part and extended upwardly. The first pipe part is arranged between the base and the second fin group. The second pipe part is penetrated through the first fin group. The distance between a top surface of the first fin group and the base is larger than the distance between a top surface of the second fin group and the base. Since influences of the dissipating area and the wind resistance are taken into consideration, the heat dissipation device has enhanced heat dissipating efficacy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.