Thermal management of thermal sensor in a mobile device
US10371578B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2015 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Nov 30, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A mobile thermal sensor system, a mobile device case, and a process for fabricating a mobile thermal sensor system are described that include using a heat spreader (e.g., a heat sink). In an implementation, the mobile thermal sensor system includes a substrate configured to support an electrical component; a thermal detector package coupled to the substrate, the thermal detector package including a first thermopile, a second thermopile, and a reference temperature detector; and a heat spreader coupled to the substrate. In another implementation, a mobile device case can include a case configured to house a mobile device, where the mobile device includes a mobile thermal sensor system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.