Systems and methods for estimating temperatures of wires in an integrated circuit chip
US10371583B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2015 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Aug 13, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/427
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods are provided for estimating a temperature of a wire of an integrated circuit (IC) chip having a plurality of heat-generating components. For each of the heat-generating components, a temperature of the heat-generating component is computed. For each of the heat-generating components, a decay profile defining a thermal coupling from the heat-generating component to wires of the IC chip is computed. For each of the heat-generating components, a temperature elevation on the wire caused by the heat-generating component is computed. The temperature elevation is computed based on the temperature and decay profile of the heat-generating component and a spatial relationship between the wire and the heat-generating component. A total temperature elevation on the wire is computed by summing the temperature elevation of each of the heat-generating components. The heat-generating components include a plurality of wires of the IC chip and at least one device of the IC chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.