Prepreg, metal-clad laminated plate, wiring board, and method for measuring thermal stress of wiring board material
US10371612B2 · kind B2 · utility
2Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2016 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Sep 9, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A prepreg includes a resin layer constituted by a half-cured product of a thermosetting resin composition, and a fibrous substrate provided in the resin layer. A prepreg test piece that is a cured product obtained by heat curing the thermosetting resin composition has a maximum value of 400 kPa or less for thermal shrinkage stress measured by a predetermined thermal stress test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.