Patent · US Active

Coupling structures for electronic device housings

US10372166B2 · kind B2 · utility

17Cited by

34References

15Claims

0Family size

Assignee

Apple Inc. · US

Inventors

Brian M. Gable · Cupertino, US
Carlo Di Nallo · Redwood City, US
Colin M. Ely · Cupertino, US
Craig A. Horton · Hillsborough, US
Erik G. de Jong · San Francisco, US
Fletcher R. Rothkopf · Los Altos, US
Henry B. Wettersten · San Francisco, US
Hoishun Li · San Jose, US
Jason C. Sauers · Cupertino, US
Jayesh Nath · Milpitas, US
Mario Martinis · Cupertino, US
Mattia Pascolini · San Francisco, US
Michael P. Coleman · Cork, IE
Rex T. Ehman · San Jose, US
Zheyu Wang · Sunnyvale, US

Key dates

Filing date	Jul 15, 2016
Grant date	Aug 6, 2019
Priority date	—
Expiry date	Jul 15, 2036

Classification

Technology area (CPC G)Physics
CPC primaryG06F1/1637
WIPO fieldTelecommunications
WIPO sectorElectrical engineering

Abstract

A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.