Semiconductor device and method of manufacturing the same
US10373898B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Mar 2, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Mar 2, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a lead frame comprising a first terminal and a second terminal for grounding, a sealing resin which covers the lead frame, an exposed part which is a part of the second terminal and is exposed from the sealing resin and a conductive material which covers the surface of the sealing resin and contacts the second terminal at the exposed part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.