Method for electrically interconnecting at least two substrates and multichip module
US10373928B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | May 1, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | May 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2005/00286
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for electrically interconnecting two substrates, each having a corresponding set of preformed electrical contacts, the substrates comprising an electronic circuit, and the resulting module, is provided. A liquid curable adhesive is provided over the set of contacts of a first substrate, and the set of electrical contacts of the second substrate is aligned with the set of electrical contacts of the first substrate. The sets of electrical contacts of the first and second substrate are compressed to displace the liquid curable adhesive from the inter-contact region, and provide electrical communication between the respective sets of electrical contacts. The liquid curable adhesive is then cured to form a solid matrix which maintains a relative compression between the respective sets of electrical contacts. One embodiment of the module comprises a high-speed superconducting circuit which operates at cryogenic temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.