Thermal-contraction matched hybrid device package
US10374000B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2013 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Aug 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
Abstract
A hybrid device package comprising a baseplate, a balanced composite structure (BCS) on the baseplate, a first IC on the BCS, and at least one additional IC physically coupled to the first IC. The coefficient of thermal expansion (CTE) for the stack formed from the BCS and the first IC is arranged to be approximately equal to that of the baseplate, thereby reducing the thermal stress to which the at least one additional IC is subjected when cooled to its operating temperature which might otherwise result in physical damage to the IC. The baseplate is preferably an alumina ceramic baseplate. In one embodiment, the first IC is a readout IC (ROIC), the at least one additional IC is a detector array IC which is on the ROIC, and the hybrid device package is a focal plane array (FPA).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.