Methods and devices for fabricating and assembling printable semiconductor elements
US10374072B2 · kind B2 · utility
18Cited by
217References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Aug 1, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/724
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.