Method of fabricating a flexible substrate and the flexible substrate fabricated thereby
US10374093B2 · kind B2 · utility
0Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Nov 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K85/623
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the inventive concepts provide a method of fabricating a flexible substrate and the flexible substrate fabricated thereby. The method includes printing a gate catalyst pattern on a separation layer, forming a gate plating pattern on the gate catalyst pattern, forming a gate insulating layer on the gate plating pattern, printing a source catalyst pattern and a drain catalyst pattern spaced apart from each other on the gate insulating layer, and forming a source plating pattern and a drain plating pattern on the source catalyst pattern and the drain catalyst pattern, respectively.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.