Busbar arrangement

US10374521B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• JÜRGEN BÖHMER · Stein, DE
• Rüdiger Kleffel · Erlangen, DE
• Eberhard Ulrich Krafft · Nürnberg, DE
• Andreas Nagel · Aberdeen, GB
• Jan Weigel · Netphen, DE

Key dates

• Filing date: Nov 25, 2016
• Grant date: Aug 6, 2019
• Expiry date: Nov 25, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H02M7/003
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A busbar arrangement for making electrical contact with a semiconductor module includes at least two busbars overlapping in an overlap region and electrically insulated from one another. Each busbar includes a web having a connection element, with the webs of the busbars being arranged without an overlap. The webs are oriented such as to define a first axis which runs through the connection element of an associated one of the webs and a point of a transition of the web to the overlap region of the busbar arrangement, and which intersects a second axis which is formed by a connection between two connection elements of the webs at an angle between 0° and 45°. The busbar arrangement includes an insulating region to reduce or prevent a current in the web in a direction perpendicular to the second axis. The overlap region and the webs are each located in one plane.