Circuit board device
US10375819B2 · kind B2 · utility
0Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2018 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Feb 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board device includes: a printed wiring board; an IC chip provided on an obverse surface of the board and having at least one ground terminal; and a wiring pattern, disposed on the board, for providing a ground potential to the ground terminal of the IC chip. The wiring pattern is disposed on a reverse surface of the printed wiring board. The circuit board device has at least one via that is connected to the wiring pattern and passes through the printed wiring board at a position within a region where the IC chip is mounted on the obverse surface of the printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.