Sleeved coaxial printed circuit board vias
US10375838B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Mar 15, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49123
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board, and a method of fabricating the printed circuit board is disclosed. The printed circuit board includes at least one coaxial via. A hollow via is disposed in the printed circuit board. A metal sleeve is formed around the circumference of said hollow via. An inner conductive path is disposed in the hollow via. Additionally, an insulating material is disposed in the hollow via, between the conducting path and the metal sleeve. The conductive path is used to connect signal traces disposed on two different layers of the printed circuit board. In some embodiments, these signal traces carry signals having a frequency above 1 GHz, although the disclosure is not limited to this embodiment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.