Devices with mounted components
US10375845B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Jun 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/14
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Devices with components mounted to a surface interior often encounter problems with generated heat, which is difficult to dissipate from a tightly packed and sealed device interior. Excessive heat may also distort the surface substrate material, which may become brittle from accumulated thermal stress and/or warp in a manner that displaces the position and/or orientation of the components. Presented herein are device manufacturing techniques in view of temperature considerations. Devices may comprise a device housing of a housing material that exhibits a substantially isotropic coefficient of thermal expansion (CTE) and/or thermal conductivity in various dimensions. Devices may also comprise a housing mount for a component cluster that is mountable on the interior surface of the device housing, with electrically conductive traces integrated with the device housing that conductively interconnect the housing mount with the component cluster, optionally generated via laser-activation of a conductive additives or deposition of conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.