Mechanically attached edge shield
US10375865B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 24, 2017 |
| Grant date | Aug 6, 2019 |
| Priority date | — |
| Expiry date | Mar 24, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10227
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The edge shields disclosed herein utilize a plated edge surface of a PCB to form one or more sides of an electronic shield to reduce the amount of top surface area of the PCB occupied by the electronic shield. More specifically, an edge shield lid is mechanically attached to the plated edge surface to remove a need for solder overprint at the edge of the PCB. The edge shield lid is soldered, welded, adhered, or mechanically attached to edge walls where there is no available edge surface for attachment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.