Packing layer for structured packing
US10376860B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 30, 2014 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Dec 20, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01J2219/32483
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The invention relates to a packing layer (1) for structured packing (20), the packing layer (1) having a plurality of structural elements (2), and the structural elements (2) being shaped and arranged in such a manner that they form a first fine structure (3), and adjacent structural elements (2) having a first spacing (a), the packing layer (1) having a plurality of protrusions (4) that are shaped and arranged in such a manner that they form a second fine structure (5), and adjacent protrusions (4) having a second spacing (b). According to the invention, the structural elements (2) and the protrusions (4) are formed without perforations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.