Patent · US Active

Apparatuses and methods for laser processing

US10377658B2 · kind B2 · utility

2Cited by

123References

20Claims

0Family size

Assignee

CORNING INCORPORATED · US

Inventors

Daniel Schnitzler · Bedburg, DE
Helmut Schillinger · Herzogenaurach, DE

Key dates

Filing date	Jul 24, 2017
Grant date	Aug 13, 2019
Priority date	—
Expiry date	Jul 24, 2037

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2103/54
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A workpiece may be laser processed by a method that may include forming a contour line in the workpiece, and directing an infrared laser beam onto the workpiece along or near the contour line to separate the workpiece along the contour line. The contour line may include defects in the workpiece. The infrared laser beam may have a beam profile such that a greater distribution of cumulated energy from the infrared laser beam is located in areas adjacent to the contour line than directly on the contour line.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.