Polymer latex composition for dip-molding applications

US10377882B2 · kind B2 · utility

Assignee

• Synthomer Sdn. Bhd. · MY

Inventors

• Thian Hong Ng · Parit Raja, MY
• Claudia Eigen · Dorsten, DE
• Alexandra Abele · Delmsen, DE
• Gareth Simpson · Cambridge, GB

Key dates

• Filing date: Dec 12, 2014
• Grant date: Aug 13, 2019
• Expiry date: Aug 5, 2035

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08F2500/26
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A polymer latex composition for dip-molding applications includes the reaction product obtained by free-radical emulsion polymerization in aqueous medium of ethylenically unsaturated monomers including; (a) 19.9 to 90 wt.-% of at least one aliphatic conjugated diene; (b) 9.9 to 80 wt.-% of at least one unsaturated nitrile; (c) 0.1 to 10 wt.-% of at least one ethylenically unsaturated acid; (d) 0 to 19 wt.-% of at least one aromatic vinyl compound, and (e) 0 to 20 wt.-% of at least one further ethylenically unsaturated compound different from any of compounds (a) to (d), the weight percentages being based on the total amount of monomers, wherein the emulsion polymerization is conducted in presence of a degraded polysaccharide having a DE of 2 to 90 measured according to ISO 5377 (Dec. 15, 1981) to a method for making said polymer latex composition, to a curable polymer latex compound including said polymer latex composition, to a method for making dip molded latex films employing said curable polymer latex compound, to a film made from said polymer latex composition and to articles including said film or being coated with said polymer latex composition.