Device for cooling heat transfer solid for precisely controlling the temperature, said device optionally being associated with an endothermic or exothermic process
US10377955B2 · kind B2 · utility
1Cited by
2References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 13, 2017 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Oct 13, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC10G2300/807
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
The present invention describes a device for controlling cooling of a heat transfer solid supplying or withdrawing heat to or from a unit carrying out globally endothermic or exothermic reactions respectively. The exchange bundle of said device is in a triangular pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.