Bump ball testing system and method
US10379156B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 31, 2015 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Jan 20, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2884
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated circuit testing system includes a conductive structure, a conductive pad electrically connected with the conductive structure, a test circuit electrically connected with the conductive pad, a conductive line electrically connected with the conductive structure, the conductive line being configured to be connected with a ground, and a controller coupled with the test circuit. The controller is configured to selectively cause the test circuit to supply a voltage to the conductive structure via the conductive pad. The test circuit is configured to provide feedback to the controller indicative of whether the conductive structure is electrically connected with the conductive pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.