Method of providing an electronic device and electronic device thereof
US10381224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2017 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Dec 4, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments include a method. The method can include: providing a carrier substrate; providing a first bond promoting layer over the carrier substrate; providing a second bond promoting layer over the carrier substrate; and depositing a first device substrate over the carrier substrate, the first bond promoting layer, and the second bond promoting layer. The first device substrate can be configured to bond to the carrier substrate with a first device substrate-carrier substrate adhesion strength. Meanwhile, depositing the first device substrate can include: bonding the first device substrate to the first bond promoting layer, the first device substrate bonding to the first bond promoting layer with a first device substrate-first bond promoting layer adhesion strength greater than the first device substrate-carrier substrate adhesion strength; and coupling the first device substrate to the carrier substrate. Other embodiments of related methods and devices are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.