Power module
US10381286B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2017 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Aug 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10166
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power module is disclosed. The power module includes a first substrate, a first metal layer, at least one conductive structure and at least one power device. The first metal layer is disposed on the first substrate. The first metal layer has a first thickness d1. The first thickness d1 satisfies: 5 μm≤d1≤50 μm. The conductive structure is disposed at a position different to the first metal layer on the first substrate. The conductive structure has a second thickness d2. The second thickness d2 satisfies: d2≥100 μm. The power device is disposed on the first substrate, the first metal layer or the conductive structure. The driving electrode of the power device is electrically connected to the first metal layer. The power electrode of the power device is electrically coupled to the conductive structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.