Method for manufacturing semiconductor device
US10381361B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 10, 2017 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Aug 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Embodiments of the inventive concepts provide a method for manufacturing a semiconductor device. The method includes forming a stack structure including insulating layers and sacrificial layers which are alternately and repeatedly stacked on a substrate. A first photoresist pattern is formed on the stack structure. A first part of the stack structure is etched to form a stepwise structure using the first photoresist pattern as an etch mask. The first photoresist pattern includes a copolymer including a plurality of units represented by at least one of the following chemical formulas 1 to 3, wherein “R1”, “R2”, “R3”, “p”, “q” and “r” are the same as defined in the description.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.