Light emitting diode chip and a method for the manufacture of a light emitting diode chip
US10381507B2 · kind B2 · utility
3Cited by
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16Claims
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Key dates
| Filing date | Mar 16, 2016 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Apr 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/811
Abstract
A method for the manufacture of a light-emitting diode (LED) chip, the method comprising providing a first substrate; forming an LED structure on the first substrate, wherein the LED structure has a first surface adjacent the first substrate and a second surface opposite the first substrate; applying a second substrate on the second surface of the LED structure; and selectively etching the first substrate from the LED structure to form one or more walls extending from the first surface of the LED structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.