Light emitting device including a lead frame and an insulating material
US10381534B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2017 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Jul 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
Abstract
Embodiments of the invention include a package for a light emitting diode (LED). The package includes a lead frame, an LED, and an optically reflective but electrically non-conductive molding. The lead frame has a first lead frame part and a second lead frame part electrically isolated from the first lead frame part, each lead frame part having at least one raised pillar. The molding is disposed over the lead frame except over the pillars of the lead frame. The LED is mounted on at least one pillar and is electrically coupled to at least one pillar. The molding serves the purpose of a highly reflective, electrically conductive material like silver without being subject to tarnishing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.