Light emitting device

US10381802B2 · kind B2 · utility

Assignee

• PHILIPS PHOTONICS GMBH · DE

Inventors

• Stephan Gronenborn · Aachen, DE
• Michael R. Miller · Winnetka, US
• Peter Dannberg · Jena, DE
• Mark Schuermann · Aachen, DE
• Holger Moench · Vaals, NL

Key dates

• Filing date: Sep 22, 2016
• Grant date: Aug 13, 2019
• Expiry date: Sep 22, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S2301/17
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The invention describes a light emitting device (100). The light emitting device (100) comprises at least one light emitting structure (110), at least one processing layer (120) and at least one optical structure (130). The optical structure (130) comprises at least one material processed by means of processing light (150). The at least one processing layer (120) is arranged to reduce reflection of the processing light (150) in a direction of the optical structure (130) at least by 50%, preferably at least by 80%, more preferably at least by 95% and most preferably at least by 99% during processing of the material by means of the processing light (150). It is a basic idea of the present invention to incorporate a non- or low-reflective processing layer (120) on top of a light emitting structure (110) like a VCSEL array in order to enable on wafer processing of light emitting structures (130) like microlens arrays. The invention further describes a method of manufacturing such a light emitting device (100).