Method for making circuit board
US10383223B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 13, 2018 |
| Grant date | Aug 13, 2019 |
| Priority date | — |
| Expiry date | Nov 13, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board film-plated against corrosion of conductive traces comprises a substrate, a conductive circuit layer attached to the substrate, a plating film attached to outer surface of the conductive circuit layer, and a covering film. Each plating film comprises a top outer surface and a side surface. The circuit board defines at least one through hole. Each through hole passes through substrate, conductive circuit layer, and the plating film. The covering film covers the conductive circuit layer, the side surfaces, and the through holes. The conductive circuit layer and the side surfaces of the plating films are sealed against the atmosphere and cannot be corroded. A method for making the circuit board is also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.