Heat transfer chassis and method for forming the same

US10383261B2 · kind B2 · utility

Assignee

• GE Global Sourcing LLC · US

Inventors

• Andrew Louis Krivonak · Erie, US
• Theodore Clark Brown · Raleigh, US
• Shreenath Shekar Perlaguri · Bengaluru, IN
• Brian Magann Rush · Schenectady, US
• Rajendra Yammanuru · Bengaluru, IN
• Naveenan Thiagarajan · Schenectady, US
• Arunpandi Radhakrishnan · Bengaluru, IN

Key dates

• Filing date: Jul 28, 2016
• Grant date: Aug 13, 2019
• Expiry date: Oct 30, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K7/20881
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.