Laser cutting array with multiple laser source arrangement
US10384306B1 · kind B1 · utility
2Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 2, 2016 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Jan 12, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/253
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided herein is an apparatus that includes a first and second laser source. The first and second laser sources are each operable to cut a substrate and are each independently movable with respect to one another. Further, the first and second laser sources are included within a multitude of laser sources that are arranged in a circular array.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.