Systems and methods for depositing compounds in a structure
US10384399B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2016 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Mar 8, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB64C2001/0072
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Presently disclosed systems and methods for depositing a compound into a void in a sandwich panel are configured to reduce the air pressure in and around the void as the compound flows into the void, thereby reducing the amount of air trapped between the compound and the sandwich panel skin within the void during the repair. Systems may include a dispenser for holding the compound, a vacuum canister, and a valve operable to allow the compound to flow from the dispenser, through at least a portion of the vacuum canister, and into the void. After the compound flows into the void, the system is configured to apply ambient air pressure to the compound and the void, before the compound is allowed to harden or cure. Some such systems are pre-filled with the compound, and/or configured to be disposable after a single use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.