Alternative ground lines for inter-slot grounding
US10384449B2 · kind B2 · utility
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8References
20Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 2, 2018 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Mar 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L24/06
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In an example implementation, a grounding structure includes a perimeter ground line around the perimeter of a printhead die, and having north, south, east, and west segments. The structure includes an inter-slot ground line extending from the north segment to the south segment between two fluid slots, and an alternative ground line extending from the east segment to the west segment and intersecting the inter-slot ground line in a connection area near ends of the fluid slots.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.