Polyamide resin, polyamide resin composition containing same, preparation method therefor, and molded product including same
US10385166B2 · kind B2 · utility
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3References
10Claims
0Family size
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Key dates
| Filing date | Apr 8, 2016 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Jun 17, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2367/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The polyamide resin of the present invention is a polymer of a monomer mixture including a dicarboxylic acid and an amine-based compound, wherein the amine-based compound comprises diamine and triamine and a branching rate measured using 1H-NMR is approximately 1% to approximately 8%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.