Method for placing at least one duct/communication cable below a road surface in an area
US10385524B2 · kind B2 · utility
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17References
10Claims
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Assignee
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Key dates
| Filing date | Nov 22, 2016 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Nov 22, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T83/9457
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A method for placing at least one duct/communication cable below a road surface in an area. The area comprises a first layer and a second layer, the first layer being a road layer, such as asphalt or concrete, and the second layer being a bearing layer for the first layer and being located below the first layer. The method comprising the steps of cutting a micro trench in the area through the first layer into the second layer, placing at least one duct/communication cable in the micro trench so that that duct/communication cable is placed below the first layer, and filling the micro trench so as to restore the road surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.