Subsurface formation modeling with integrated stress profiles
US10386523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2014 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | May 21, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01V11/002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method, apparatus, and program product model stress characteristics of a subsurface formation based at least in part on acoustic data and image data associated with the subsurface formation. The acoustic data is analyzed to determine acoustic based stress values, and the image data is analyzed to determine image based stress values. The acoustic based stress values and the image based stress values are integrated to generate an integrated stress profile that includes one or more modeled stress characteristics of the subsurface volume.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.