Imprint method and apparatus
US10386717B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2014 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Jan 16, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/0005
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An imprint method includes: placing a light-curable composition on a workpiece substrate (placement); bringing the light-curable composition and a mold into contact with each other an atmosphere of a condensable gas (contact); aligning the mold and the workpiece substrate (alignment); irradiating the light-curable composition with light to obtain a light-cured composition (irradiation); and separating the light-cured composition and the mold from each other after the irradiation (release). The film thickness of the light-curable composition during the alignment is 20% or more greater than that of the light-cured composition after the release.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.