Multilayer seed pattern inductor, manufacturing method thereof, and board having the same
US10388447B2 · kind B2 · utility
7Cited by
1References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2015 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Jan 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/048
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer seed pattern inductor includes: a magnetic body containing a magnetic material; and an internal coil part encapsulated in the magnetic body, wherein the internal coil part includes a seed pattern and a surface plating layer disposed on the seed pattern, the seed pattern being formed as two or more layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.