Electrostatic chuck device with multiple fine protrusions or multiple fine recesses
US10389278B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2014 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Oct 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6875
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is an electrostatic chuck device in which the attachment of particles to the rear surface of a plate-like specimen can be further suppressed by suppressing the generation source of the particles and, furthermore, an effect of cooling the plate-like specimen using a cooling gas can be improved. The electrostatic chuck device is formed by including an electrostatic chuck portion in which an upper surface (2a) of a ceramic plate-like body (2) is used as a placement surface on which a wafer is placed and an electrostatic adsorption electrode is provided inside the ceramic plate-like body (2) or on the rear surface thereof, multiple protrusions (11) are formed on the upper surface (2a), and multiple fine protrusions (13) are formed in regions (12) excluding the multiple protrusions (11) in the upper surface (2a).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.