LED assembly having base insert molded about terminals and substrate with a plurality of LED chips positioned on said substrate
US10390399B2 · kind B2 · utility
0Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2014 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Jan 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B45/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED assembly is disclosed that comprises a based formed around terminals and a substrate. An LED array is positioned on the substrate in a recess. The LED array is electrically coupled to the terminals, which may be part of a connector formed in the base. An emission disk can be positioned over the LED array. If desired, circuitry can be supplied on the base that helps control or condition the supplied power.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.