Method for encasing an electric unit and electrical structural element
US10390435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2018 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Feb 18, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for encasing an electrical unit includes connecting the electrical unit to a leadframe and encasing the electrical unit with a first plastic material to form an inner molded body, so that a plurality of contacts of the electrical unit project from the inner molded body. The inner molded body is punched out of the lead frame. The method also includes connecting at least one first contact and one second contact to a shunt resistor. The inner molded body is encased with a second plastic material to form an outer molded body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.