Thermal isolation of cryo-cooled components from circuit boards or other structures
US10390455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2017 |
| Grant date | Aug 20, 2019 |
| Priority date | — |
| Expiry date | Mar 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20372
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a substrate having a recess and a first insulator submerged in the recess of the substrate. The apparatus also includes a cover having a second insulator that, together with the first insulator, defines an insulated volume. The apparatus further includes one or more components to be cooled located over the first insulator and within the insulated volume. The apparatus could also include one or more electrical conductors located over the first insulator, where at least one of the one or more components is electrically connected to the one or more electrical conductors. The one or more electrical conductors could be submerged in the recess of the substrate. The one or more electrical conductors could be thermally-insulative at cryogenic temperatures and could include carbon nanotubes. The first and second insulators could include foam or aerogel insulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.