Paste material, wiring member formed from the paste material, and electronic device including the wiring member
US10392518B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 27, 2017 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Apr 30, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a paste material, a method of forming the paste material, a wiring member formed from the paste material, and an electronic device including the wiring member. The paste material may include a plurality of liquid metal particles and a polymer binder. The paste material may further include a plurality of nanofillers. At least some of the plurality of nanofillers may each have an aspect ratio equal to or greater than about 3. A content of the plurality of liquid metal particles may be greater than a content of the polymer binder and may be greater than a content of the plurality of nanofillers. The wiring member may be formed by using the paste material, and the wiring member may be used in various electronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.