Adhesive compositions with repair-rework ability
US10392532B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2016 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Jul 21, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2469/006
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An adhesive composition is provided that includes a block copolymer present at greater than or equal to 30 total weight percent of the adhesive system comprising a high glass transition temperature in subunits Y and Y′, each of the subunits Y and Y′ having a high glass transition temperature of from 70° C. to 130° C. with a low glass transition temperature subunit Z having a low glass transition temperature of from −100° C. to 10° C. intermediate between said high glass transition temperature acrylate subunits to define a structure Y-Z-Y′. The triblock copolymer is dissolved in a monomer curable under free radical. A free radical initiator of a peroxide or a hydroperoxide are present in combination with a sulfonyl chloride, dihydropyridine and copper or vanadium salt. By heating the cured adhesive at or above 70° C., the adhesive is amenable to being removed, repaired, or reworked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.