Method of forming a component module
US10393320B2 · kind B2 · utility
0Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2018 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Oct 12, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a component module is disclosed. A base is provided, the base being electrically conductive. An insulative layer is also provided on the base, with a first area being substantially free of the insulative layer. First and second traces are provided on the insulative layer adjacent the first area, with these traces extending therefrom. A die is positioned on the first area and electrically connected to the first and second traces. Finally, a protective layer is provided over the die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.