Measuring device and method for substrate warping amount
US10393511B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Jul 25, 2017 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Dec 1, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/1309
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measuring device and method for a substrate warping amount includes a first substrate and a second substrate disposed oppositely. The measuring device includes a light source, a measuring eyepiece and a processor. The light source is configured to emit a monochromatic light to a region to be measured of the display motherboard, and form a Newton ring interference pattern. The measuring eyepiece is configured to acquire the Newton ring interference pattern and measure a diameter and a corresponding order number of each interference fringe in the Newton ring interference pattern. The processor is connected to the measuring eyepiece and configured to obtain a thickness of an air layer at each interference fringe according to the diameter and the corresponding order number of each interference fringe and a wavelength of the monochromatic light, to obtain a warping amount of the region to be measured of the display motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.