Heat flux gage
US10393598B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2016 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Mar 9, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N19/101
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Metal interconnect layers on a top surface connected through holes to interconnect layers of the same or interconnect layers of a thermoelectrically different material on a bottom surface material on the bottom surface. Through hole connection provided by a material of the same or similar thermoelectric material as interconnects. A second metal of a thermoelectrically different material than the first interconnect layer is connected through a second hole from the top side interconnect to the bottom side interconnect. A second through hole connection provided by a metal of the same or similar thermoelectric material as the interconnect layer on the bottom side. Layers are connected in an alternating fashion to form a differential thermocouple. The pattern is created by printing conductive metallic inks on the surfaces and through holes, or by a combination of plating and etching processes and printing conductive metallic inks on the surfaces and through holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.