Deformable apparatus and method
US10393599B2 · kind B2 · utility
1Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2015 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Sep 23, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01M5/0083
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and method wherein the apparatus comprises: a deformable substrate; a curved support structure; at least one support configured to space the curved support structure from the substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way; and a capacitive sensor comprising a protruding electrode capacitively coupled to an overlaying electrode; wherein the protruding electrode protrudes from a side of the curved support structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.