Backlight module and display device using same
US10393950B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Sep 8, 2016 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Oct 1, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/009
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A backlight module having better heat dissipation, includes a backboard, a frame coupled to a peripheral area of the backboard, at least one light source, and a thermally conductive layer located on the backboard. The backboard is made of a thermally conductive material. The at least one light source is embedded in the thermally conductive layer and in direct contact with the thermally conductive layer which removes heat as it is generated by the light source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.