Apparatus, system, and method for dissipating heat from expansion components
US10394291B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2017 |
| Grant date | Aug 27, 2019 |
| Priority date | — |
| Expiry date | Nov 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interface adapter may include a printed circuit board that includes an edge connector dimensioned to be inserted into an expansion socket of a computing device. The interface adapter may also include a plurality of modular computing components removably mounted to a top surface of the printed circuit board, where each modular computing component includes a connector dimensioned to be inserted into a socket of the printed circuit board and the connector of each modular computing component includes a pinout that is more compact than a pinout of the edge connector of the printed circuit board. In addition, the interface adapter may include one or more modular heatsinks coupled to a top surface of each modular computing component to facilitate heat dissipation from the top surface of the modular computing component. Various other apparatuses, systems, and methods are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.